iimveliso

Iimveliso

I-Microstrip Isolator

Ii-Microstrip isolators zizixhobo ze-RF kunye ne-microwave ezisetyenziswa rhoqo ekudluliseni isignali kunye nokwahlulwa kwiisekethe. Isebenzisa ubuchwepheshe befilimu encinci ukwenza isekethe phezu kwe-ferrite yemagnethi ejikelezayo, ize yongeze intsimi yemagnethi ukuze ifezekise oko. Ukufakelwa kwee-microstrip isolators ngokuqhelekileyo kusebenzisa indlela yokutshixa ngesandla imicu yobhedu okanye i-gold wire bonding. Ulwakhiwo lwee-microstrip isolators lulula kakhulu, xa luthelekiswa nee-coaxial kunye nee-embedded isolators. Umahluko ocacileyo kukuba akukho mgodi, kwaye umqhubi we-microstrip isolator wenziwa ngokusebenzisa inkqubo yefilimu encinci (i-vacuum sputtering) ukwenza ipateni eyilwe kwi-rotary ferrite. Emva kokufaka i-electroplating, umqhubi ovelisiweyo uncamathiselwa kwi-rotary ferrite substrate. Ncamathisela umaleko we-insulating medium phezu kwegrafu, kwaye ulungise intsimi yemagnethi kwi-medium. Ngesakhiwo esilula kangaka, kwenziwe i-microstrip isolator.

Uluhlu lweefrikhwensi ukusuka kwi-2.7 ukuya kwi-43GHz

Usetyenziso lwezomkhosi, lwendawo kunye nolwezorhwebo.

Ukulahleka okuphantsi kokufakwa, ukwahlulwa okuphezulu, ukuphathwa kwamandla aphezulu.

Uyilo olucwangcisiweyo luyafumaneka xa luceliwe.


Iinkcukacha zeMveliso

Iithegi zeMveliso

Ishiti yedatha

 I-RFTYT 2.0-30GHz Microstrip Isolator
Imodeli Uluhlu lwefrikhwensi
(
iGHz)
Faka ilahleko(dB)
(Ubuninzi)
Ukuzahlula (dB)
(Ubuncinane)
I-VSWR
(Ubuninzi)
Ubushushu bokusebenza
(
℃)
Amandla aphezulu
(W)
Amandla Abuyela Umva
(
W)
Ubukhulu
W×L×Hmm
Inkcazo
MG1517-10 2.0~6.0 1.5 10 1.8 -55~85 50 2 15.0*17.0*4.0 I-PDF
MG1315-10 2.7~6.2 1.2 1.3 1.6 -55~85 50 2 13.0*15.0*4.0 I-PDF
MG1214-10 2.7~8.0 0.8 14 1.5 -55~85 50 2 12.0*14.0*3.5 I-PDF
MG0911-10 5.0~7.0 0.4 20 1.2 -55~85 50 2 9.0*11.0*3.5 I-PDF
MG0709-10 5.0~13 1.2 11 1.7 -55~85 50 2 7.0*9.0*3.5 I-PDF
MG0675-07 7.0~13.0 0.8 15 1.45 -55~85 20 1 6.0*7.5*3.0 I-PDF
MG0607-07 8.0-8.40 0.5 20 1.25 -55~85 5 2 6.0*7.0*3.5 I-PDF
MG0675-10 8.0-12.0 0.6 16 1.35 -55~+85 5 2 6.0*7.0*3.6 I-PDF
MG6585-10 8.0~12.0 0.6 16 1.4 -40~+50 50 20 6.5*8.5*3.5 I-PDF
MG0719-15 9.0~10.5 0.6 18 1.3 -30~+70 10 5 7.0*19.5*5.5 I-PDF
MG0505-07 10.7~12.7 0.6 18 1.3 -40~+70 10 1 5.0*5.0*3.1 I-PDF
MG0675-09 10.7~12.7 0.5 18 1.3 -40~+70 10 10 6.0*7.5*3.0 I-PDF
MG0506-07 11~19.5 0.5 20 1.25 -55~85 20 1 5.0*6.0*3.0 I-PDF
MG0507-07 12.7~14.7 0.6 19 1.3 -40~+70 4 1 5.0*7.0*3.0 I-PDF
MG0505-07 13.75~14.5 0.6 18 1.3 -40~+70 10 1 5.0*5.0*3.1 I-PDF
MG0607-07 14.5~17.5 0.7 15 1.45 -55~+85 5 2 6.0*7.0*3.5 I-PDF
MG0607-07 15.0-17.0 0.7 15 1.45 -55~+85 5 2 6.0*7.0*3.5 I-PDF
MG0506-08 17.0-22.0 0.6 16 1.3 -55~+85 5 2 5.0*6.0*3.5 I-PDF
MG0505-08 17.7~23.55 0.9 15 1.5 -40~+70 2 1 5.0*5.0*3.5 I-PDF
MG0506-07 18.0~26.0 0.6 1 1.4 -55~+85 4   5.0*6.0*3.2 I-PDF
MG0445-07 18.5~25.0 0.6 18 1.35 -55~85 10 1 4.0*4.5*3.0 I-PDF
MG3504-07 24.0~41.5 1 15 1.45 -55~85 10 1 3.5*4.0*3.0 I-PDF
MG0505-08 25.0~31.0 1.2 15 1.45 -40~+70 2 1 5.0*5.0*3.5 I-PDF
MG3505-06 26.0~40.0 1.2 11 1.6 -55~+55 4   3.5*5.0*3.2 I-PDF
MG0505-62 27.0~-31.0 0.7 17 1.4 -40~+75 1 0.5 5.0*11.0*5.0 I-PDF
MG0511-10 27.0~31.0 1 18 1.4 -55~+85 1 0.5 5.0*5.0*3.5 I-PDF
MG0505-06 28.5~30.0 0.6 17 1.35 -40~+75 1 0.5 5.0*5.0*4.0 I-PDF

Isishwankathelo

Iingenelo ze-microstrip isolators ziquka ubungakanani obuncinci, ubunzima obulula, ukungahlali kakuhle kwendawo xa zidityaniswe neesekethe ze-microstrip, kunye nokuthembeka okuphezulu koqhagamshelo. Iingxaki zayo kukuba amandla aphantsi kunye nokungaxhathisi kakuhle kuphazamiseko lwe-electromagnetic.

Imigaqo yokukhetha i-microstrip isolators:
1. Xa kususwa kwaye kudityaniswa iisekethe, kunokukhethwa ii-microstrip isolators.

2. Khetha imodeli yemveliso ehambelanayo ye-microstrip isolator ngokusekelwe kuluhlu lweefrikhwensi, ubungakanani bofakelo, kunye nesikhokelo sothumelo esisetyenzisiweyo.

3. Xa iifrequencies zokusebenza zombini ubukhulu be-microstrip isolators zinokuhlangabezana neemfuno zokusetyenziswa, iimveliso ezinevolumu enkulu zihlala zinamandla aphezulu.

Uqhagamshelo lwesekethe lwe-microstrip isolators:
Uqhagamshelo lungenziwa ngokusebenzisa i-soldering ngesandla enemicu yobhedu okanye i-gold wire bonding.

1. Xa uthenga imicu yobhedu yokudibanisa ukuwelda ngesandla, imicu yobhedu kufuneka yenziwe ibe yimo ye-Ω, kwaye i-solder mayingangeni kwindawo yokwenza umcu wobhedu. Ngaphambi kokuwelda, ubushushu bomphezulu we-isolator kufuneka bugcinwe phakathi kwama-60 kunye nama-100 ° C.

2. Xa usebenzisa i-gold wire bonding interconnection, ububanzi be-gold strip kufuneka bube buncinci kunobubanzi be-microstrip circuit, kwaye i-composite bonding ayivumelekanga.


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